ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,966, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Hiroyuki Nakamura (Tokyo) and Shiori Uota (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a conductive die bonding portion, a semiconductor element bonded to an upper surface of the die bonding portion, a sealing member sealing the die bonding portion and the semiconductor element, and a flexible insulating member bonded to a lower surface of the die bonding portion. The flexible insulating member is arranged in a recessed portion on a lower surface of the sealing member and has a convex portion protruding f...