US Patent Issued to Mitsubishi Electric on July 14 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,184, issued on July 14, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor module" was invented by Kensuke Takeuchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "This semiconductor module includes: a base plate formed in a plate shape; a terminal member; an electronic component joined to one surface of the base plate; and mold resin sealing the base plate, the terminal member, and the electronic component. The base plate and the terminal member are conductive members and are arranged with an interval therebetween on the same plane. Each of the base plate and the terminal member has a body portion and a terminal portion exposed...