US Patent Issued to MITSUBISHI ELECTRIC on July 14 for "Method and device for making integrated cooling liquid cavity in printed circuit board" (French Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,181, issued on July 14, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Method and device for making integrated cooling liquid cavity in printed circuit board" was invented by Julien Morand (Rennes, France) and Stefan Mollov (Rennes, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention concerns a method and a device for making an integrated cooling liquid cavity in a printed circuit board by inserting a power semiconductor die in a dielectric material, laminating the dielectric material with a dielectric material and a thin electrically conducting layer on each side of the dielectric material, drilling vias through the lam...