ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,649, issued on Feb. 17, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor module" was invented by Kosuke Yamaguchi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a semiconductor module capable achieving both a heat radiation property and an insulation property. A semiconductor module includes: a substrate having a main surface and a main surface on a side opposite to the main surface; a semiconductor device mounted on the main surface; and a heat sink attached to the main surface via an insulation sheet having a thermal conductivity, wherein the substrate includes a through hole passing from the main su...