ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,916, issued on Aug. 18, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Resin-sealed semiconductor device" was invented by Ryuichi Ishii (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin-sealed semiconductor device is configured in such a way that a second bonding material has a melting point higher than that of a first bonding material made of a solder-bonding material, in such a way that one of bonding surfaces through which a power module and a cooling device are bonded to each other with the first bonding material is the other surface portion of a copper plate, and the other one of the bonding surfaces is the surface portion, at ...