US Patent Issued to Mitsubishi Electric on Aug. 11 for "Semiconductor module and life prediction system for semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,602, issued on Aug. 11, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor module and life prediction system for semiconductor module" was invented by Masataka Shiramizu (Tokyo), Kazuhiro Kawahara (Tokyo) and Hirohito Yamashita (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the invention is to provide the semiconductor module which can predict a life precisely, and the life prediction system for the semiconductor module. The semiconductor module according to the present invention includes IGBTs, diodes, measurement circuits for measuring characteristics of the IGBTs and the diodes, and a memory for storing initial ...