ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,830, issued on April 21, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device and method for manufacturing semiconductor device" was invented by Taketo Nishiyama (Tokyo) and Kenji Saito (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A lead frame connects a metal wiring and an electrode of a case. A seal material is filled in the case. The lead frame includes a first joint portion joined to the metal wiring, a second joint portion joined to the electrode, and a connection portion connecting the first joint portion and the second joint portion. The connection portion includes an inclined portion inclined with respect to the...