ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,864, issued on April 21, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device" was invented by Junya Sakai (Tokyo) and Kenji Hatori (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a plurality of semiconductor chips spaced apart from one another; and a conductive part. The plurality of semiconductor chips include respective semiconductor switching elements. The conductive part connects the plurality of semiconductor chips in parallel. A material of the semiconductor switching elements of the plurality of semiconductor chips includes a wide bandgap semiconductor. At least one of the semicondu...