US Patent Issued to Mitsubishi Chemical on Nov. 3 for "Silica particle, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,780,671, issued on Nov. 3, was assigned to Mitsubishi Chemical Corp. (Tokyo).

"Silica particle, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device" was invented by Naoko Sumitani (Tokyo), Tsutomu Yonemori (Tokyo), Eiji Dejima (Tokyo) and Yasuhiro Kawase (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a silica particle, a silica sol containing the silica particle, and a polishing composition containing the silica sol, which prevent secondary aggregation, have excellent dispersion stability, and are suitable for p...