US Patent Issued to MITSUBISHI CHEMICAL, GELEST on Aug. 11 for "Tin compound and resist solution using the same, pattern forming method, thin film, patterned thin film, and method for producing tin compound" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,713, issued on Aug. 11, was assigned to MITSUBISHI CHEMICAL Corp. (Tokyo) and GELEST INC. (Morrisville, Pa.).

"Tin compound and resist solution using the same, pattern forming method, thin film, patterned thin film, and method for producing tin compound" was invented by Yuta Hioki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "As a high-performance resist material that can have high purity and uniform solubility, the following tin compound is provided. The tin compound includes: a tin atom; an organic group R; and at least one of an oxo-ligand a hydroxo-ligand, wherein the tin compound has a diffraction angle 2Theta (deg) of a peak with a str...