ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,495, issued on June 30, was assigned to MIKRO MESA TECHNOLOGY Co. LTD. (Apia, Samoa).
"Method of manufacturing interconnection structure" was invented by Li-Yi Chen (Tainan City, Taiwan) and Chieh-Ting Chen (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing an interconnection structure includes: forming a first patterned photoresist on a bottom metal layer; etching the bottom metal layer to form first and second lower metal patterns; partially anodizing the etched bottom metal layer; removing the first patterned photoresist to expose a surface portion of the second lower metal pattern that is unanodized; d...