ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,724, issued on April 7, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.).
"Thermal transfer structures for immersion cooling" was invented by Sreya Sarkar (Chicago), Kathryn M. Oseen-Senda (Seattle) and Dennis Trieu (Calgary, Canada).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermal management device is described. The device includes a substrate having a spreader surface and a plurality of thermal features connected to the spreader surface of the substrate. At least one thermal feature includes a body having a longitudinal axis and a hollow bore having an inner diameter perpendicular to the longitudinal axis and an opening a...