US Patent Issued to Micron Technology on Sept. 29 for "Semiconductor assemblies with system and methods for aligning dies using registration marks" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,341, issued on Sept. 29, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor assemblies with system and methods for aligning dies using registration marks" was invented by Shiro Uchiyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device assemblies having features that are used to align semiconductor dies, and associated systems and methods, are disclose herein. In some embodiments, a semiconductor device assembly includes substrate that has a top surface and an alignment structure at the top surface. A first die is disposed over the top surface of the substrate, and the first die has a first channel that e...