US Patent Issued to Micron Technology on Sept. 1 for "Integrated circuits with selectable packaging types" (Indian Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,516, issued on Sept. 1, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated circuits with selectable packaging types" was invented by Kishan Chanumolu (Bengaluru, India) and Sandeep Dwivedi (Bengaluru, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes a die with a first face, a second face opposite the first face, and a third face located between the first face and the second face, I/O cells coupled to the first face of a die, where the I/O cells are configured to be selectively bonded to a package by wirebonded interconnections at a first pitch or flip-chip interconnections at a second pitch that is larger th...