US Patent Issued to Micron Technology on Oct. 27 for "Microelectronic devices including vertically stacked structures with distributed control logic regions, and related electronic systems and methods" (Idaho Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,632, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho).

"Microelectronic devices including vertically stacked structures with distributed control logic regions, and related electronic systems and methods" was invented by Fatma Arzum Simsek-Ege (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device comprises a first microelectronic device structure and a second microelectronic device structure vertically neighboring the first microelectronic device structure. The first microelectronic device structure comprises a first memory array region and a first control logic device region and the second micr...