US Patent Issued to Micron Technology on May 19 for "Semiconductor die stacks and associated systems and methods" (California, Idaho Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,148, issued on May 19, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor die stacks and associated systems and methods" was invented by Hernan A. Castro (Shingle Springs, Calif.) and Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor die stacks and associated systems and methods are disclosed. In an embodiment, a semiconductor die stack corresponds to a pair of a logic die and a memory die directly bonded together. The logic die includes integrated circuits generated by relatively high temperature process steps whereas the memory die includes memory cells with materials generated using relat...