US Patent Issued to Micron Technology on May 19 for "Apparatus including multiple high bandwidth memory cubes" (Idaho, Texas Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,319, issued on May 19, was assigned to Micron Technology Inc. (Boise, Idaho).

"Apparatus including multiple high bandwidth memory cubes" was invented by Lingming Yang (Meridian, Idaho), Raghukiran Sreeramaneni (Frisco, Texas) and Nevil N. Gajera (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus including a high bandwidth memory circuit and associated systems and methods are disclosed herein. The apparatus may include multiple HBM cubes connected to a processor, such as a GPU. The HBM cubes may be connected in series or in parallel. One or more of the HBM cubes can include a secondary communication circuit configured to faci...