US Patent Issued to Micron Technology on May 12 for "Methods for optimizing semiconductor device placement on a substrate for improved performance, and associated systems and methods" (Idaho Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,626,731, issued on May 12, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods for optimizing semiconductor device placement on a substrate for improved performance, and associated systems and methods" was invented by James S. Rehmeyer (Boise, Idaho) and Christopher G. Wieduwilt (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of optimizing the placement of memories in a memory device including a substrate and an electrical component, and associated devices and systems, are disclosed herein. A representative method includes first testing the memories to determine at least one parameter for each of the memories indicating a...