US Patent Issued to Micron Technology on May 12 for "Layouts of data pads on a semiconductor die" (Japanese, German Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,690, issued on May 12, was assigned to Micron Technology Inc. (Boise, Idaho).

"Layouts of data pads on a semiconductor die" was invented by Andreas Kuesel (Munich), Takamasa Suzuki (Tokyo), Jens Polney (Munich), Seiji Narui (Kanagawa, Japan) and Shiro Uchiyama (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Layouts for data pads on a semiconductor die are disclosed. An apparatus may include circuits, a first edge, a second edge perpendicular to the first edge, a third edge opposite the first edge, and a fourth edge opposite the second edge. The apparatus may also include data pads variously electrically coupled to the circuits. The da...