US Patent Issued to Micron Technology on March 31 for "Integrated assemblies having liners or rings surrounding regions of conductive posts" (Idaho Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,680, issued on March 31, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies having liners or rings surrounding regions of conductive posts" was invented by John D. Hopkins (Meridian, Idaho), Alyssa N. Scarbrough (Boise, Idaho) and Jordan D. Greenlee (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a first memory region, a second memory region offset from the first memory region, and an intermediate region between the first and second memory regions. Channel-material-pillars are arranged within the first and second memory regions. Conductive posts are arran...