US Patent Issued to Micron Technology on March 3 for "Support pillars with multiple, alternating epitaxial silicon for horizontal access devices in vertical three-dimensional (3D) memory" (Idaho Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,615, issued on March 3, was assigned to Micron Technology Inc. (Boise, Idaho).

"Support pillars with multiple, alternating epitaxial silicon for horizontal access devices in vertical three-dimensional (3D) memory" was invented by David K. Hwang (Boise, Idaho), Yoshitaka Nakamura (Boise, Idaho), Scott E. Sills (Boise, Idaho), Si-Woo Lee (Boise, Idaho), Yuanzhi Ma (Boise, Idaho) and Glen H. Walters (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices and storage nodes formed in tiers. And, more particularly, t...