US Patent Issued to Micron Technology on March 24 for "Methods and apparatus for integrating carbon nanofiber into semiconductor devices using W2W fusion bonding" (Idaho Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,502, issued on March 24, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods and apparatus for integrating carbon nanofiber into semiconductor devices using W2W fusion bonding" was invented by Wei Zhou (Boise, Idaho), Bret K. Street (Meridian, Idaho) and Amy R. Griffin (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly that includes carbon nanofibers (CNFs) for heat dissipation has a CNF layer. Molding compound encapsulates the CNF layer to form an encapsulated CNF layer. The molding compound extends between individual adjacent CNFs within the encapsulated CNF layer, and upper edges of at least ...