US Patent Issued to Micron Technology on March 24 for "Integrated assemblies and methods forming integrated assemblies" (Idaho Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,226, issued on March 24, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies and methods forming integrated assemblies" was invented by Che-Chi Lee (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a laterally-extending container-shaped first capacitor electrode, and having a laterally-extending container-shaped second capacitor electrode laterally offset from the first capacitor electrode. Capacitor dielectric material lines interior surfaces and exterior surfaces of the container-shaped first and second capacitor electrodes. A shared capacitor electrode ex...