ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,147, issued on March 24, was assigned to Micron Technology Inc. (Boise, Idaho).
"Filling cracks on a substrate via" was invented by Quang Nguyen (Boise, Idaho), Christopher Glancey (Boise, Idaho) and Koustav Sinha (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is provided. The assembly includes a substrate having a first layer with a first contact and a second layer with a second contact. A via that includes a first conductive material electrically couples the first contact and the second contact. A second conductive material having a lower melting point than the first conductive material is disposed at...