US Patent Issued to Micron Technology on March 24 for "Dielectric interposer with electrical-connection cut-in" (Singaporean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,527, issued on March 24, was assigned to Micron Technology Inc. (Boise, Idaho).

"Dielectric interposer with electrical-connection cut-in" was invented by Chin Hui Chong (Singapore), Seng Kim Ye (Singapore), Hong Wan Ng (Singapore) and Kelvin Aik Boo Tan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a base layer, a dielectric interposer coupled to the base layer and including a first outer surface facing the base layer and an opposing second outer surface facing away from the base layer ...