US Patent Issued to Micron Technology on March 17 for "Wire bonding directly on exposed conductive vias and interconnects and related systems and methods" (Singaporean Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,976, issued on March 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Wire bonding directly on exposed conductive vias and interconnects and related systems and methods" was invented by Kelvin Tan Aik Boo (Singapore), Seng Kim Ye (Singapore), Hong Wan Ng (Singapore), Ling Pan (Singapore) and See Hiong Leow (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Stacked semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having at least a first layer and a second layer, an interconnect extending through the package substrate, a s...