US Patent Issued to Micron Technology on March 17 for "Semiconductor device assembly substrates with tunneled interconnects, and methods for making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,014, issued on March 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assembly substrates with tunneled interconnects, and methods for making the same" was invented by Yun Ting Hsu (Taichung, Taiwan), Chong Leong Gan (Taichung, Taiwan), Min Hua Chung (Taichung, Taiwan) and Yung Sheng Zou (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is provided. The assembly includes a package substrate which has a tunneled interconnect structure. The tunneled interconnect structure has a solder-wettable surface, an interior cavity, and at least one microvia extending from the surfac...