US Patent Issued to Micron Technology on March 17 for "Methods for fusion bonding semiconductor devices to temporary carrier wafers with cavity regions for reduced bond strength, and semiconductor device assemblies formed by the same" (Idaho Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,582,001, issued on March 17, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods for fusion bonding semiconductor devices to temporary carrier wafers with cavity regions for reduced bond strength, and semiconductor device assemblies formed by the same" was invented by Wei Zhou (Boise, Idaho), Bret K. Street (Meridian, Idaho), Terrence B. McDaniel (Boise, Idaho), Amy R. Griffin (Boise, Idaho), Kyle K. Kirby (Eagle, Idaho) and Thiagarajan Raman (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of making a semiconductor device assembly are provided. The methods can comprise providing a first semiconductor device having a fir...