US Patent Issued to Micron Technology on June 9 for "Semiconductor device assemblies and systems with improved thermal performance and methods for making the same" (Idaho Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,077, issued on June 9, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies and systems with improved thermal performance and methods for making the same" was invented by Hyunsuk Chun (Boise, Idaho) and Xiaopeng Qu (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor device assemblies are provided with one or more layers of thermally conductive material disposed between adjacent semiconductor dies in a vertical stack. The thermally conductive material can be configured to conduct heat generated by one or more of the semiconductor dies in laterally outward towards an outer edge of the assembly. ...