US Patent Issued to Micron Technology on June 16 for "Semiconductor devices, assemblies, and associated methods" (Idaho Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,689, issued on June 16, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor devices, assemblies, and associated methods" was invented by Raj K. Bansal (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly can include an assembly substrate having a top surface with a die stack thereat. The die stack can include a first and a second die, and each dies can include a die substrate with a top and a bottom surface. The top surface can include a first region a first distance from the bottom surface, and a second region a second distance, greater than the first distance, from the bottom surface and wi...