US Patent Issued to Micron Technology on July 28 for "Triple via chain for advanced interconnect in a memory device" (Idaho Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,694,939, issued on July 28, was assigned to Micron Technology Inc. (Boise, Idaho).

"Triple via chain for advanced interconnect in a memory device" was invented by Ivo Thomas Wambeke (Boise, Idaho), James Eric Davis (Meridian, Idaho), Joshua Daniel Tomayer (Meridian, Idaho), Fulvio Rori (Boise, Idaho), Chiara Cerafogli (Boise, Idaho) and Kenneth William Marr (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device can include a first portion having a memory array comprising a plurality of memory cells and a first via chain segment for performing a test operation. The memory device can include a second portion comprising processing cir...