US Patent Issued to Micron Technology on July 21 for "Data throughput using a metal bracket" (Indian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,172, issued on July 21, was assigned to Micron Technology Inc. (Boise, Idaho).

"Data throughput using a metal bracket" was invented by Deepu Narasimiah Subhash (Yeshwanthpu, India), Suresh Reddy Yarragunta (Bangalore, India) and Koneri Sathyanarayana Guptha Amith (Banaswadi, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triang...