US Patent Issued to Micron Technology on July 14 for "Chip select wiring for a dual device package" (Idaho Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,197, issued on July 14, was assigned to Micron Technology Inc. (Boise, Idaho).

"Chip select wiring for a dual device package" was invented by Scott R. Cyr (Boise, Idaho) and David P. Gooch (Meridian, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and devices for chip select wiring for a dual device package are described. A circuit board includes a plurality of layers, the plurality of layers including a first outer layer, a second inner layer, and a third outer layer. The circuit board also includes first and second chip select (CS) signal lines routed through the second inner layer of the circuit board, first and second memo...