US Patent Issued to Micron Technology on Jan. 20 for "Methods and assemblies for measurement and prediction of package and die strength" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,775, issued on Jan. 20, was assigned to Micron Technology Inc. (Boise, Idaho).

"Methods and assemblies for measurement and prediction of package and die strength" was invented by Chien Ming Chen (Taichung, Taiwan), Shams U. Arifeen (Boise, Idaho), Chong Leong Gan (Taichung, Taiwan) and Christopher Glancey (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods for measuring and predicting the strength of semiconductor devices and packaging are disclosed. In some embodiments, a semiconductor device assembly comprises a package substrate, a semiconductor die electrically coupled to the package substrate, and a molding covering...