US Patent Issued to Micron Technology on Aug. 4 for "Semiconductor dies including recesses for facilitating mechanical debonding, and associated systems and devices" (Idaho Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,061, issued on Aug. 4, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor dies including recesses for facilitating mechanical debonding, and associated systems and devices" was invented by Wei Zhou (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor dies and devices, such as memory dies and devices, and associated systems and methods, are disclosed herein. A representative semiconductor die comprises a substrate including a first surface, a second surface opposite the first surface, a perimeter, and a recess formed into the first surface adjacent to the perimeter. The recess has a depth in a direction extendi...