US Patent Issued to Micron Technology on Aug. 25 for "Memory device for wafer-on-wafer formed memory and logic" (Idaho, Washington, California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,718,870, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Memory device for wafer-on-wafer formed memory and logic" was invented by Glen E. Hush (Boise, Idaho), Sean S. Eilert (Penryn, Calif.), Aliasger T. Zaidy (Seattle) and Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device includes an array of memory cells configured on a die or chip and coupled to sense lines and access lines of the die or chip and a respective sense amplifier configured on the die or chip coupled to each of the sense lines. Each of a plurality of subsets of the sense lines is coupled to a respective local input/out...