US Patent Issued to Micron Technology on Aug. 25 for "Integrated assemblies, and methods of forming integrated assemblies" (Italian, Japanese, American Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,718,847, issued on Aug. 25, was assigned to Micron Technology Inc. (Boise, Idaho).

"Integrated assemblies, and methods of forming integrated assemblies" was invented by Yoshiaki Fukuzumi (Kanagawa, Japan), Paolo Tessariol (Arcore, Italy), David H. Wells (Boise, Idaho), Lars P. Heineck (Boise, Idaho), Richard J. Hill (Boise, Idaho), Lifang Xu (Boise, Idaho), Indra V. Chary (Boise, Idaho) and Emilio Camerlenghi (Bergamo, Italy).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some embodiments include an integrated assembly having a pair of adjacent memory-block-regions, and having a separator structure between the adjacent memory-block-regions. The memory-bl...