US Patent Issued to Micron Technology on Aug. 18 for "Semiconductor device assemblies with coplanar interconnect structures, and methods for making the same" (Idaho Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,898, issued on Aug. 18, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies with coplanar interconnect structures, and methods for making the same" was invented by Thiagarajan Raman (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is provided. The assembly includes a substrate with an inner and outer surface, a plurality of semiconductor devices disposed on the inner surface, a central interconnect structure disposed between the devices, a plurality of peripheral interconnect structures disposed around the devices, and an encapsulant material at least partially encapsula...