US Patent Issued to Micron Technology on Aug. 11 for "Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same" (Idaho Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,967, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device assemblies including monolithic silicon structures for thermal dissipation and methods of making the same" was invented by Kunal R. Parekh (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device assembly is provided. The assembly includes a first semiconductor device including a plurality of electrical contacts on an upper surface thereof; a monolithic silicon structure having a lower surface in contact with the upper surface of the first semiconductor device, the monolithic silicon structure including a cavity extending f...