ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,706,281, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho).
"Erosion rate monitoring for wafer fabrication equipment" was invented by Synn Nee Chow (Singapore), Robert Brian Skaggs (Kuna, Idaho), Chao Lin Lee (Singapore) and Alex James Schrinsky (Boise, Idaho).
According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, systems, and apparatuses for erosion rate monitoring for wafer fabrication equipment are described to support determining a real-time edge ring erosion rate for an edge ring used in manufacturing memory devices or other semiconductor devices. A manufacturing system may support a real-time edge ring erosion rate determina...