US Patent Issued to Micron Technology on April 7 for "Solid state optoelectronic device with preformed metal support substrate" (Idaho Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,845, issued on April 7, was assigned to Micron Technology Inc. (Boise, Idaho).

"Solid state optoelectronic device with preformed metal support substrate" was invented by Vladimir Odnoblyudov (Eagle, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer-level process for manufacturing solid state lighting ("SSL") devices using large-diameter preformed metal substrates is disclosed. A light emitting structure is formed on a growth substrate, and a preformed metal substrate is bonded to the light emitting structure opposite the growth substrate. The preformed metal substrate can be bonded to the light emitting structure via a metal-metal bond, s...