US Patent Issued to Micron Technology on April 14 for "Semiconductor device interconnects formed through volumetric expansion" (Idaho Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,755, issued on April 14, was assigned to Micron Technology Inc. (Boise, Idaho).

"Semiconductor device interconnects formed through volumetric expansion" was invented by Kyle K. Kirby (Eagle, Idaho), Terrence B. McDaniel (Boise, Idaho) and Wei Zhou (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "This document discloses techniques, apparatuses, and systems for semiconductor device interconnects formed through volumetric expansion. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die and the second semiconductor die are bonded at a dielectric layer of the first semiconductor die and a die...