US Patent Issued to Microchip Technology on April 14 for "Devices including capacitor coupling power path to ground path and associated components and systems" (Canadian Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,729, issued on April 14, was assigned to Microchip Technology Inc. (Chandler, Ariz.).

"Devices including capacitor coupling power path to ground path and associated components and systems" was invented by Yuming Tao (Ottawa).

According to the abstract* released by the U.S. Patent & Trademark Office: "The device may include a core. The device may include built-up layers arranged over the core. The device may also include a ground path disposed in a first built-up layer of the built-up layers. The device may also include a power path disposed in a second built-up layer of the built-up layers. The device may also include a multi-terminal capacitor on a top layer of the built-up lay...