US Patent Issued to Microchip Technology Caldicot on March 24 for "Method for forming flipped-conductor-patch" (British Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,145, issued on March 24, was assigned to Microchip Technology Caldicot Ltd. (Caldicot, Great Britain).

"Method for forming flipped-conductor-patch" was invented by John Adam Tracy deMercleden Smithells (Caldicot, Great Britain) and Nina Biddle (Coleford, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes providing a layer of non-conductive material having a conductive electroplating seed layer formed on a surface thereof; applying a photoresist layer over the surface of the conductive electroplating seed layer; and defining wiring channels in the photoresist resist layer. The method includes electroplating a conductive m...