ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,965, issued on Sept. 15, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).
"Thermoplastic interposer" was invented by Brian Toleno (Cupertino, Calif.), Michael Nikkhoo (Saratoga, Calif.), Arman Boromand (Issaquah, Wash.), Sheng Ye (Redmond, Wash.), Andrew John Ouderkirk (Kirkland, Wash.) and Jonathan Robert Peterson (Woodinville, Wash.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate h...