US Patent Issued to Meta Platforms Technologies on Oct. 27 for "Modified structures for reducing capacitive coupling" (California, Washington Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,580, issued on Oct. 27, was assigned to Meta Platforms Technologies LLC (Menlo Park, Calif.).

"Modified structures for reducing capacitive coupling" was invented by Yasuo Morimoto (Cupertino, Calif.), Boon Shiu (Palo Alto, Calif.), Javier Rodriguez De Luis (Kirkland, Wash.) and Jiang Zhu (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed system may include a conductive frame, at least one transparent substrate that is structurally secured by the conductive frame, a transparent antenna applied to a surface of the transparent substrate, and an antenna feed electrically positioned at an insertion point between the conductiv...