US Patent Issued to Meta Platforms on May 12 for "Die level integrated connection test circuit and method therefor" (California Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,620, issued on May 12, was assigned to Meta Platforms Inc. (Menlo Park, Calif.).

"Die level integrated connection test circuit and method therefor" was invented by Ahmad Byagowi (Menlo Park, Calif.) and Pradip Sairam Pichumani (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, an integrated circuit (IC) chip package, includes a die; and die level diagnostic cell circuitry embedded in the die at a die level diagnostic testing location, wherein the die level diagnostic cell circuitry located at the die level diagnostic testing location incorporates a die level diagnostic stimulus to test a diagnostic trace of the die w...