US Patent Issued to MELLANOX TECHNOLOGIES on July 7 for "Removable lid for flip chip-ball grid array (FC-BGA) packages" (Israeli Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,380, issued on July 7, was assigned to MELLANOX TECHNOLOGIES LTD. (Yokneam, Israel).

"Removable lid for flip chip-ball grid array (FC-BGA) packages" was invented by Eitan Ariel Caplan (Haifa, Israel), Yogev Buzaglo (Kiryat Ata, Israel) and Ilan Avraham Langut (Yuvalim, Israel).

According to the abstract* released by the U.S. Patent & Trademark Office: "Assemblies, systems, and methods are described herein for a removable lid for flip chip-ball grid array (FC-BGA) packages. An example removable lid assembly for an integrated circuit (IC) package includes at least one pedestal configured to be attached to a substrate, a lid configured to be reversibly secured to the at least one ped...