US Patent Issued to MEKTEC on Sept. 8 for "Flexible printed board and flexible printed board connection structure" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,096, issued on Sept. 8, was assigned to MEKTEC Corp. (Tokyo).

"Flexible printed board and flexible printed board connection structure" was invented by Masanori Hirata (Tokyo), Garo Miyamoto (Tokyo) and Shunsuke Aoyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a flexible printed board including: an insulating base material; a plurality of first wiring lines disposed on a front surface side of the base material; a plurality of first terminals each provided on an external connection side, of a respective one of the plurality of first wiring lines; a plurality of second wiring lines disposed on a rear surface side of the base mat...