US Patent Issued to MEKTEC on March 24 for "Electronic equipment sealing structure and method for manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,153, issued on March 24, was assigned to MEKTEC Corp. (Tokyo).

"Electronic equipment sealing structure and method for manufacturing the same" was invented by Hirokazu Iwaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is an electronic equipment sealing structure that includes a case, a flexible printed circuit board, and an adhesive layer, in which the case includes a case body, an opening provided in the case body, and a pair of thin plate portions having flexibility; part of the flexible printed circuit board is inserted into the case body through the opening; one thin plate portion and the other thin plate portion of the pair o...